Coupling & Crosstalk: Disposable Chips?

April 8, 2014

cups plates forks canstockphoto2604892 250x345Coupling & Crosstalk is my column in the MEPTEC Report. This column appears in the Spring 2014 edition on pages 10-11.

Electronic coupling is the transfer of energy from one circuit or medium to another. Sometimes it is intentional and sometimes not (crosstalk). I hope that this column by mixing technology and general observations is thought provoking and “couples” with your thinking. Most of the time I will stick to technology but occasional crosstalk diversions may deliver a message closer to home.

Disposable Chips?

I’m not a fan of disposable cups and other tableware. Yes, they are convenient and in some cases even economical. However, they are not great substitutes for Read the rest of this entry »


BiTS Workshop – The Next 15 Years

March 26, 2014

Thanks to the BiTS Committee for the hard work to make this a great event!

Thanks to the BiTS Committee for the hard work to make this a great event!


Wow! The Burn-in and Test Strategy (BiTS) Workshop just turned 15! The world of semiconductors has certainly changed over the years. And the BiTS Workshop has kept up with what is “Now & Next” in the burn-in and test of packaged integrated circuits (ICs). These achievements were celebrated in style by the more than three hundred participants at the recently held 2014 BiTS Workshop in Mesa, Arizona.

“When the BiTS Workshop started in 2000, there were no Read the rest of this entry »


SEMI ISS 2014 – Scaling Innovation

February 4, 2014

Courtesy of Ivo Bolsens (Xilinx), SEMI ISS 2014

Courtesy of Ivo Bolsens (Xilinx), SEMI ISS 2014

Don’t pop the champagne just yet! Although plenty of good news was shared at the 2014 SEMI Industry Strategy Symposium (ISS) there was the sobering outlook of possible limited long-term growth due to technology issues as well as economic projections. Noticeable was the lack of news and updates on key industry developments.

This is the yearly “data rich” or “data overload” (take your pick) conference of semiconductor supply chain executives. The majority of the attendees and presenters are from the SEMI member companies that develop the equipment, materials, processes, and technology used to build, test, and package semiconductors. Keeping the pressure on for advanced technology were the “end customer” attendees and presenters – semi-conductor manufacturers.

The official theme was “Pervasive Computing – An Enabler for Future Growth” and the presentations made it clear  Read the rest of this entry »


Coupling & Crosstalk: A Trillion Sensors?

January 31, 2014

Janusz Bryzek's TSensor Vision

Janusz Bryzek’s TSensor Vision

Coupling & Crosstalk is my column in the MEPTEC Report. This column appears in the Winter 2014 edition on pages 10-11.

Electronic coupling is the transfer of energy from one circuit or medium to another. Sometimes it is intentional and sometimes not (crosstalk). I hope that this column by mixing technology and general observations is thought provoking and “couples” with your thinking. Most of the time I will stick to technology but occasional crosstalk diversions may deliver a message closer to home.

Name Calling

Whatever you desire “there’s an app for that!” Dream big or small, it is very likely a software program is already available. But what if you dream in hardware?  Hewlett-Packard is building applications with one MILLION sensors. Robert Bosch is dreaming of 1,000 sensors per person, i.e. seven TRILLION. Janusz Bryzek is aiming for one TRILLION per year.

Standardized smartphone hardware platforms and application “stores” have significantly lowered the cost and time to develop and sell applications. One might argue Read the rest of this entry »


Chip Scale Review: The Three Most Important Words for 3D ICs?

December 19, 2013
Source: Bryan Black (AMD)

Source: Bryan Black (AMD)

Below is my event summary recently published in Chip Scale Review Tech Monthly:

Cost! Cost! Cost! are the three most important words for 3D semiconductors.

Just like the real estate mantra “location, location, location”, if you don’t have a solution to the cost issues nothing else matters for 2.5/3D integrated circuit (IC) integration and packaging. It is true that, Xilinx is shipping “production” quantities of 2.5D parts and others have sampled 3D parts. However, there are plenty of technical challenges yet to be solved to make 2.5/3D practical in volume production at reasonable cost and yield.

Every presenter at the 3D Architectures for Semiconductor Integration and Packaging symposium and conference stressed cost as a major concern, requirement, or feature. Over the ten years the discussion at this conference, organized by RTI International Technology Venture Forum, has moved from Read the rest of this entry »


Chip Scale Review: International Wafer Level Packaging Conference (IWLPC) Turns 10!

December 10, 2013

IWLPC_logo

Below is my event summary recently published in Chip Scale Review Tech Monthly:

Market adoption is increasing rapidly for wafer level packaging (WLP) as it is applied to a greater range of applications. The shift of “Post-PC” from desktop to mobile devices has driven the development of WLP into the mainstream by providing extremely space efficient and low cost packaging. There has and will continue to be many technical and business challenges in packaging devices on wafer (or other substrate) en masse instead of on an individual basis.

Similar to wafer level packaging technology itself, the 2013 International Wafer-Level Packaging Conference (IWLPC) Read the rest of this entry »


Coupling & Crosstalk: Priorities First! Or Last? Or Not At All?

October 10, 2013

pina colada - canstockphoto1826026
 Coupling & Crosstalk is my column in the MEPTEC Report. This column appears in the Fall 2013 edition on page 12.

Electronic coupling is the transfer of energy from one circuit or medium to another. Sometimes it is intentional and sometimes not (crosstalk). I hope that this column by mixing technology and general observations is thought provoking and “couples” with your thinking. Most of the time I will stick to technology but occasional crosstalk diversions may deliver a message closer to home.

 

Priorities First! Or Last? Or Not At All?

Do I confuse being busy with being productive?

Does being efficient help me reach my goals?

What should my goals be?

Maybe I’m too much of a management geek since I spend my “lazy” summer days thinking about these topics instead of working on my tan.  Okay, truth be told Read the rest of this entry »


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