Don’t pop the champagne just yet! Although plenty of good news was shared at the 2014 SEMIIndustry Strategy Symposium (ISS) there was the sobering outlook of possible limited long-term growth due to technology issues as well as economic projections. Noticeable was the lack of news and updates on key industry developments.
This is the yearly “data rich” or “data overload” (take your pick) conference of semiconductor supply chain executives. The majority of the attendees and presenters are from the SEMI member companies that develop the equipment, materials, processes, and technology used to build, test, and package semiconductors. Keeping the pressure on for advanced technology were the “end customer” attendees and presenters – semi-conductor manufacturers.
As the number of probes on probe cards increase due to greater parallelism, driven by the desire for one touchdown testing and the future transition to 450 mm wafers, the total force required to probe a wafer increases if there is no reduction in the force per probe. This wafer prober chuck needs to apply the required force by pushing the wafer against the probe card typically held in place by the structure of the prober. With 200K probes on a 450 mm wafer each requiring 5 gF this is approximately equal to 1 ton (2205 lbF) of applied force. To reduce these force requirements wafer chuck and prober structure, Advantest and JEM have Continue reading “IEEE Semiconductor Wafer Test Workshop 2012 – Session 5 (Tuesday)”