Coupling & Crosstalk: Moore Has Left the Building!

June 21, 2016

Dollars-Electronics canstockphoto8813445 Geleol 300x330Coupling & Crosstalk is my column in the MEPTEC Report. This column appears in the Summer 2016 edition on pages 12-13.

Electronic coupling is the transfer of energy from one circuit or medium to another. Sometimes it is intentional and sometimes not (crosstalk). I hope that this column, by mixing technology and general observations, is thought provoking and “couples” with your thinking. Most of the time I will stick to technology but occasional crosstalk diversions may deliver a message closer to home.

Moore has Left the Building!

Unlike Elvis, Gordon Moore, the co-founder of Intel, is still with us. Although the debate continues among very smart people as to whether Moore’s Law is “truly dead”, this argument is now purely academic. As the electronics industry has moved to the “Post Personal Computer (PC) Era”, Moore’s Law which accurately predicted price over time for complementary metal–oxide–semiconductor (CMOS) integrated circuits, is no longer relevant.

Heresy! Did he just say that Moore’s Law doesn’t matter? Read the rest of this entry »


SEMI ISS 2014 – Scaling Innovation

February 4, 2014
Courtesy of Ivo Bolsens (Xilinx), SEMI ISS 2014

Courtesy of Ivo Bolsens (Xilinx), SEMI ISS 2014

Don’t pop the champagne just yet! Although plenty of good news was shared at the 2014 SEMI Industry Strategy Symposium (ISS) there was the sobering outlook of possible limited long-term growth due to technology issues as well as economic projections. Noticeable was the lack of news and updates on key industry developments.

This is the yearly “data rich” or “data overload” (take your pick) conference of semiconductor supply chain executives. The majority of the attendees and presenters are from the SEMI member companies that develop the equipment, materials, processes, and technology used to build, test, and package semiconductors. Keeping the pressure on for advanced technology were the “end customer” attendees and presenters – semi-conductor manufacturers.

The official theme was “Pervasive Computing – An Enabler for Future Growth” and the presentations made it clear  Read the rest of this entry »


Chip Scale Review: The Three Most Important Words for 3D ICs?

December 19, 2013
Source: Bryan Black (AMD)

Source: Bryan Black (AMD)

Below is my event summary recently published in Chip Scale Review Tech Monthly:

Cost! Cost! Cost! are the three most important words for 3D semiconductors.

Just like the real estate mantra “location, location, location”, if you don’t have a solution to the cost issues nothing else matters for 2.5/3D integrated circuit (IC) integration and packaging. It is true that, Xilinx is shipping “production” quantities of 2.5D parts and others have sampled 3D parts. However, there are plenty of technical challenges yet to be solved to make 2.5/3D practical in volume production at reasonable cost and yield.

Every presenter at the 3D Architectures for Semiconductor Integration and Packaging symposium and conference stressed cost as a major concern, requirement, or feature. Over the ten years the discussion at this conference, organized by RTI International Technology Venture Forum, has moved from Read the rest of this entry »


Riding Off Into the Sunset – BiTS 2013

March 14, 2013
Sunset over Phoenix, Arizona during BiTS Workshop

Sunset over Phoenix, Arizona during BiTS Workshop

As the Burn-in & Test Strategies (BiTS) Workshop 2013 fades into the sunset (queue the music), here is a round-up of the highlights. There were gun fights in the corral as well as technical questions for the presenters. The saloon girls and gunfighters took an edge off of the “geek” factor. This year over three hundred fifty people come to the “Circle BiTS Ranch” (aka the Hilton in Mesa, Arizona) for the premier conference focused on what is new and next for semiconductor test tooling and strategy. Oh, did I mention that the theme this year was Western?

This was the 14th annual BiTS Workshop, which has achieved the perfect conference trifecta of Read the rest of this entry »


Two Conferences – Two Industries Challenged By Post PC Era

March 15, 2012

Tim Cook introducing Apple's latest iPad

The “Post Personal Computer” (Post PC) era became the hot topic when Tim Cook introduced the latest iPad last week. Yes, calling it a “revolution” is definitely hype that is part of Apple‘s Post PC marketing campaign. Hype aside, it is clear that there has been a marked shift in digital hardware for the consumption of content and communication. The PC – be it a Windows, Mac, or Linux based system – is no longer “the device”. It is now one of many devices including portable music players (dominated by iPods), smart phones (lead by iPhones and Android based systems), and tablets (dominated by iPads). The shift is large and the impact is huge. To understand how big, watch the first three minutes of Mr. Cook’s presentation. Then you will understand why Apple had the largest market capitalization of any US company in February – the numbers are staggering.

Even though many were surprised to learn that we are now “Post PC”, some of us who have been developing strategies for the electronic supply chain have Read the rest of this entry »


Silicon Valley Test Workshop – 2nd Year “Rocks”

November 28, 2011
2 5D? 3D? What? 3D IC Packaging - Ira Feldman

Click image to download presentation

Back for the second year (with a minor name change), the Silicon Valley Test Workshop is an unpolished gem. Looking past the rough edges (minor logistical issues), what really shines through is the interaction of the participants. This conference really has Read the rest of this entry »