Skip to content

High Technology Business Development – Ira Feldman

Tag: ToThePoint

Silicon Valley Test Workshop – 2nd Year “Rocks”

2 5D? 3D? What? 3D IC Packaging - Ira Feldman
Click image to download presentation

Back for the second year (with a minor name change), the Silicon Valley Test Workshop is an unpolished gem. Looking past the rough edges (minor logistical issues), what really shines through is the interaction of the participants. This conference really has Continue reading “Silicon Valley Test Workshop – 2nd Year “Rocks””

Author Ira FeldmanPosted on November 28, 2011May 21, 2012Categories 2.5D/3D Stacked Integrated Circuits (ICs), Automatic Test Equipment (ATE), Load Boards, Moore's Law, More than Moore, My Presentations, Packaging (Semiconductor), Printed Circuit Boards (PCB), Probe Cards, Semiconductor Test, Test Engineers, Through-Silicon Vias (TSV), ToThePointTags 2.5D/3D Stacked Integrated Circuits (ICs), Automatic Test Equipment (ATE), Load Boards, Moore's Law, More than Moore, My Presentations, Packaging (Semiconductor), Printed Circuit Boards (PCV), Probe Cards, Semiconductor Test, Test Engineers, Through-Silicon Vias (TSV), ToThePoint

Ira Feldman's Blog

My musings and thoughts on high technology, business development, product management and life in general...

Enter your email address to subscribe to this blog and receive notifications of new posts by email.

RSS links for my blog

RSS Feed RSS - Posts

RSS Feed RSS - Comments

Search

Recent Posts

  • Coupling & Crosstalk: Replacing the Road
  • Science First, Last, and Always!
  • Coupling & Crosstalk: Roller Coasters & Proverbs
  • Coupling & Crosstalk: Trust your Paranoia!
  • Coupling & Crosstalk: KGD Redux?
  • Coupling & Crosstalk: 5 Thoughts About 5G
  • Coupling & Crosstalk: Look beyond the small screen to get the big picture!
  • Coupling & Crosstalk: Knowledge worker or knowledge serf?
  • Coupling & Crosstalk: Milking It!
  • Coupling & Crosstalk: Project Management – What me worry?
  • Coupling & Crosstalk: Testing the Supply Chain
  • Coupling & Crosstalk: 1, 2, 3, 4 … 5G – Ready in 2020?
  • Coupling & Crosstalk: “We are on fire!” – Good News, Bad News, or Both?
  • Coupling & Crosstalk: Smoke and Mirrors? A Failure in Three Acts
  • Coupling & Crosstalk: Quality, Meet Safety & Security!
  • Coupling & Crosstalk: Avoiding Ruts and Nuts!
  • Coupling & Crosstalk: Moore Has Left the Building!
  • Coupling & Crosstalk: Engineering: The Solution to Software Quality!
  • Coupling & Crosstalk: Headlines, trend lines, or expertise?
  • Coupling & Crosstalk: Over Connected?
  • Semiconductor Wafer Test Workshop 2015 Presentation – Are You Really Going To Package That?
  • Coupling & Crosstalk: Products or Services?
  • Coupling & Crosstalk: First World Problems
  • Trillion Sensors – TApps: Ultra-High Volume Sensor Applications for Global Challenges
  • Coupling and Crosstalk: Medically Deficient Technology
  • Coupling & Crosstalk: MVP for Hardware Development?
  • IEEE Semiconductor Wafer Test Workshop 2014 Presentation
  • Coupling & Crosstalk: Disposable Chips?
  • BiTS Workshop – The Next 15 Years
  • SEMI ISS 2014 – Scaling Innovation

Post Categories

  • 2.5D/3D Stacked Integrated Circuits (ICs) (18)
  • 3-D Microstructures (1)
  • 450 mm wafers (9)
  • 5G (2)
  • American Innovation Working Group (1)
  • Apple (5)
  • Architecture (2)
  • Automatic Test Equipment (ATE) (16)
  • Batteries (3)
  • Bioscience (4)
  • BiTS Workshop (4)
  • Children (2)
  • Chip Scale Review (3)
  • Clean Tech (Green) (6)
  • Cloud Computing (1)
  • CMOS Imagers (3)
  • Coaching (2)
  • Competitive Analysis (1)
  • Conferences (1)
  • Consulting (3)
  • Consumer Electronics Society (2)
  • Cost of Test (11)
  • Coupling & Crosstalk (26)
  • Data Waves (3)
  • Design Cycles (2)
  • DRAM (8)
  • Economics (10)
  • Education (4)
  • Electric Vehicles (1)
  • Energy (3)
  • Engineering (2)
  • Environment (5)
  • European Union (EU) (1)
  • Fabs (3)
  • Feldman Engineering (4)
  • Fiber Optic Interconnect (2)
  • FLASH Memory (8)
  • Full Wafer / 1 Touch Down Test (5)
  • Fundamentals (3)
  • Global / Grand Challenges (4)
  • Healthcare (6)
  • High Aspect Ratio Structures (1)
  • High Frequency (RF) Testing (2)
  • High Performance Computing (HPC) (1)
  • High Speed Rail (1)
  • High Technology Business Development (1)
  • High Volume Manufacturing (HVM) (21)
  • Home (3)
  • IEEE (36)
  • Inkjet (1)
  • Innovation (3)
  • Interconnectology (5)
  • International Technology Roadmap for Semiconductors (ITRS) (5)
  • Internet of Things (8)
  • Intersolar (1)
  • ITO Replacement (2)
  • Japan (2)
  • Lean Development (1)
  • Learning (4)
  • LIGA (1)
  • Load Boards (9)
  • Management (13)
  • Manufacturing (10)
  • Market Analysis (8)
  • Marketing (15)
  • Medical Devices (5)
  • Memory Technology (1)
  • MEMS (19)
  • MEMS Journal (5)
  • MEMS Test (5)
  • MEPTEC (31)
  • Microfabrication (6)
  • Mobile Devices (3)
  • Moore's Law (11)
  • More than Moore (10)
  • Multi Layer Ceramics (MLC) (4)
  • Multi Layer Organics (1)
  • My Presentations (12)
  • Nanotechnology (14)
  • Not Known Bad Die (aka KGD – Known Good Die) (2)
  • Operations (5)
  • Packaging (Semiconductor) (16)
  • Photolithography (7)
  • Post PC Era (2)
  • Printed Circuit Boards (PCB) (14)
  • Probe Card Metrology Tools (6)
  • Probe Cards (38)
  • Product Management (15)
  • Project Management (4)
  • Quality (6)
  • Reliability (2)
  • Roll-to-Roll Manufacturing (2)
  • SEMI (9)
  • SEMICON West (1)
  • Semiconductor Capital Equipment (CAPEX) (17)
  • Semiconductor Test (49)
  • Semiconductor Wafer Test Workshop (36)
  • Semiconductors (24)
  • Services (1)
  • Simulation (7)
  • Skiing (1)
  • Software (1)
  • Solar (7)
  • Space Transformers (5)
  • Spring Pins (3)
  • Standards (2)
  • Statistical Process Control (SPC) (1)
  • Strategic Planning (4)
  • Supercomputers (1)
  • Teaching (1)
  • Teardown / Reverse Engineering (2)
  • Test Engineers (10)
  • TestConX (1)
  • Thin Film (1)
  • Through-Silicon Vias (TSV) (6)
  • ToThePoint (3)
  • Travel (4)
  • TSensors (5)
  • Uncategorized (2)
  • Water (4)
  • What's New (3)
  • Yield Improvement (2)

Copyright © 2010-2019 Ira Feldman.

Unauthorized use and/or duplication of this material without express and written permission is strictly prohibited. Excerpts and links may be used, provided that full and clear credit is given to Ira Feldman and this blog with appropriate and specific direction to the original content.

High Technology Business Development – Ira Feldman Blog at WordPress.com.
  • Follow Following
    • High Technology Business Development - Ira Feldman
    • Join 144 other followers
    • Already have a WordPress.com account? Log in now.
    • High Technology Business Development - Ira Feldman
    • Customize
    • Follow Following
    • Sign up
    • Log in
    • Report this content
    • View site in Reader
    • Manage subscriptions
    • Collapse this bar