Wow! The Burn-in and Test Strategy (BiTS) Workshop just turned 15! The world of semiconductors has certainly changed over the years. And the BiTS Workshop has kept up with what is “Now & Next” in the burn-in and test of packaged integrated circuits (ICs). These achievements were celebrated in style by the more than three hundred participants at the recently held 2014 BiTS Workshop in Mesa, Arizona.
As the Burn-in & Test Strategies (BiTS) Workshop 2013 fades into the sunset (queue the music), here is a round-up of the highlights. There were gun fights in the corral as well as technical questions for the presenters. The saloon girls and gunfighters took an edge off of the “geek” factor. This year over three hundred fifty people come to the “Circle BiTS Ranch” (aka the Hilton in Mesa, Arizona) for the premier conference focused on what is new and next for semiconductor test tooling and strategy. Oh, did I mention that the theme this year was Western?
Larry Levy (FormFactor, Inc.), “Is Parametric Testing About To Enter a Period of Growth and Innovation?”:
Upwards of one thousand facilities perform parametric wafer testing (based on 2009 market data) with over a third of these using obsolete test equipment. There have been no really new testers in several years – Agilent still has their 40xx series and Keithley has their S530 tester. And several companies have exited the market and some companies (including Keithley) are no longer supporting older models of testers. Since parametric testing remains an essential process, this has forced a high number of these facilities to use obsolete equipment or find other approaches. A few companies are going as far as using an Advantest 93000, a significantly more expensive and highly sophisticated digital tester, for parametric test. [Updated to clarify Keithley’s status.]
I discussed lower cost solutions that appear counter-intuitive since they require increased technical and operational complexity. Challenges of testing MEMS devices while still on wafer (prior to packaging and singulation) were discussed along with a review of MEMS solutions at this year’s IEEESemiconductor Wafer Test Workshop.
With the proper skills, experience, and perspective it is possible to avoid “re-inventing the wheel” and to develop the best strategy to profitably introduce new technologies to high volume manufacturing.