The MEMS Testing and Reliability 3rd Annual Conference gets high marks: excellent speakers focused on an emerging topic and it was large enough to have “critical mass” while allowing everyone to interact. It was well produced by MEMS Investor Journal and MEPTEC.
My presentation, “Semiconductor Wafer Test Technology and Trends: Lessons for MEMS Test Engineers“, covered the differences between testing semiconductors and microelectromechanical systems (MEMS). I reviewed the progress in test technology over the last fifty plus years, from simple cantilever probe cards to large full wafer contact probe cards, developed to reduce the cost of test.
I discussed lower cost solutions that appear counter-intuitive since they require increased technical and operational complexity. Challenges of testing MEMS devices while still on wafer (prior to packaging and singulation) were discussed along with a review of MEMS solutions at this year’s IEEE Semiconductor Wafer Test Workshop.
With the proper skills, experience, and perspective it is possible to avoid “re-inventing the wheel” and to develop the best strategy to profitably introduce new technologies to high volume manufacturing.