At the 24th annual IEEE
Semiconductor Wafer Test Workshop (SWTW) on Wednesday June 11, 2014,
I had the pleasure of presenting “International Technology Roadmap for Semiconductors”. This presentation was co-authored with Dave Armstrong (Advantest) and Marc Loranger (FormFactor).
For the last fifteen years the International Technology Roadmap for Semiconductors (ITRS) has been looking fifteen years into the future. Based upon technology requirements and other inputs, ranging from the gate size of transistors to advanced packaging technology, the Test and Test Equipment Technical Working Group (Test TWG) has worked to develop the requirements for test technology and equipment.
The Test TWG is over seventy volunteers with deep technical expertise in test from around the world and from every sized company – Fortune 100 to individual consultants – and every type of company – semiconductor independent device manufacturer (IDM), fabless semiconductor, foundry, outsourced assembly and test (OSAT), automated test equipment (ATE) suppliers, prober, probe card, socket, handler, and more. Through a significant effort this team updates the roadmap on a yearly basis to predict the future needs of product test.
This presentation provides an overview of the ITRS process – how the “input drivers” are used to drive the test roadmap – along with what the test section roadmap contains that pertains to wafer test. It also reviews the latest trends and challenges in general and wafer probe requirements in specific. It will help viewers understand what sections of the roadmap is relevant to their test challenges.