Category: Product Management

Coupling & Crosstalk: Smoke and Mirrors? A Failure in Three Acts

credit card house of cards canstockphoto22380257_250x250Coupling & Crosstalk is my column in the MEPTEC Report. This column appears in the Summer 2017 edition on pages 10-11.

Electronic coupling is the transfer of energy from one circuit or medium to another. Sometimes it is intentional and sometimes not (crosstalk). I hope that this column, by mixing technology and general observations, is thought provoking and “couples” with your thinking. Most of the time I will stick to technology but occasional crosstalk diversions may deliver a message closer to home.

Smoke and Mirrors? A Failure in Three Acts

Wow, that’s cool and I really want one! In fact it is a perfect solution to _______. Those are typically my first Continue reading “Coupling & Crosstalk: Smoke and Mirrors? A Failure in Three Acts”

Coupling & Crosstalk: Quality, Meet Safety & Security!

Coupling & Crosstalk is my column in the MEPTEC Report. This column appears in the Winter 2016 edition on pages 8-9.

Electronic coupling is the transfer of energy from one circuit or medium to another. Sometimes it is intentional and sometimes not (crosstalk). I hope that this column, by mixing technology and general observations, is thought provoking and “couples” with your thinking. Most of the time I will stick to technology but occasional crosstalk diversions may deliver a message closer to home.

Quality, Meet Safety & Security!

What can be simpler to specify or install than a light bulb controlled by a wall switch? Over-engineered versions, especially when developed without engineers, can really cause you to lose sleep. However, the real nightmare is the danger of Continue reading “Coupling & Crosstalk: Quality, Meet Safety & Security!”

Coupling & Crosstalk: Over Connected?

Apple-Watch-Shinya_Suzuki_flickr17078894786_ec2467b9e6_o_crop_600x551Coupling & Crosstalk is my column in the MEPTEC Report. This column appears in the Summer 2015 edition on pages 11-12.

Electronic coupling is the transfer of energy from one circuit or medium to another. Sometimes it is intentional and sometimes not (crosstalk). I hope that this column, by mixing technology and general observations, is thought provoking and “couples” with your thinking. Most of the time I will stick to technology but occasional crosstalk diversions may deliver a message closer to home.

Over Connected?

I’m torn. Should I buy an Apple Watch? Is this an ego trip or clearly a left versus right brain decision? Regular readers of my column know how much I appreciate Jony Ive’s designs and that Apple generally does an excellent job of both engineering and marketing. However, those who are familiar with my work and personality know Continue reading “Coupling & Crosstalk: Over Connected?”

Coupling & Crosstalk: Products or Services?

products-services-canstockphoto10272610-300x300Coupling & Crosstalk is my column in the MEPTEC Report. This column appears in the Spring 2015 edition on pages 10-11.

Electronic coupling is the transfer of energy from one circuit or medium to another. Sometimes it is intentional and sometimes not (crosstalk). I hope that this column, by mixing technology and general observations, is thought provoking and “couples” with your thinking. Most of the time I will stick to technology but occasional crosstalk diversions may deliver a message closer to home.

Products or Services?

“Paper or Plastic?” A simple grocery store inquiry? Think again: this decision has many layers of complexity as does the examination of products versus services. There have been endless discussions as to the benefits and downsides of paper, versus plastic, bags. Everything from environmental concerns, to reusability, to biodegradability, and much more has been deliberated. Just when we thought that the paper bag had Continue reading “Coupling & Crosstalk: Products or Services?”

Coupling & Crosstalk: MVP for Hardware Development?

feature box canstockphoto15992543 300x341Coupling & Crosstalk is my column in the MEPTEC Report. This column appears in the Summer 2014 edition on page 8.

Electronic coupling is the transfer of energy from one circuit or medium to another. Sometimes it is intentional and sometimes not (crosstalk). I hope that this column by mixing technology and general observations is thought provoking and “couples” with your thinking. Most of the time I will stick to technology but occasional crosstalk diversions may deliver a message closer to home.

MVP for Hardware Development?

Just like professional sports leagues, lean product management has MVPs! Sports teams try out players, compete, and then end the season with “Most Valuable Players” and champions. Unlike sports, winning product managers start out with Minimum Viable Products (MVPs) early on to Continue reading “Coupling & Crosstalk: MVP for Hardware Development?”

SEMI ISS 2014 – Scaling Innovation

Courtesy of Ivo Bolsens (Xilinx), SEMI ISS 2014
Courtesy of Ivo Bolsens (Xilinx), SEMI ISS 2014

Don’t pop the champagne just yet! Although plenty of good news was shared at the 2014 SEMI Industry Strategy Symposium (ISS) there was the sobering outlook of possible limited long-term growth due to technology issues as well as economic projections. Noticeable was the lack of news and updates on key industry developments.

This is the yearly “data rich” or “data overload” (take your pick) conference of semiconductor supply chain executives. The majority of the attendees and presenters are from the SEMI member companies that develop the equipment, materials, processes, and technology used to build, test, and package semiconductors. Keeping the pressure on for advanced technology were the “end customer” attendees and presenters – semi-conductor manufacturers.

The official theme was “Pervasive Computing – An Enabler for Future Growth” and the presentations made it clear  Continue reading “SEMI ISS 2014 – Scaling Innovation”

Semiconductor Wafer Test Technology and Trends: Lessons for MEMS Test Engineers

Lessons for MEMS Test Engineers
Click image to download presentation

The MEMS Testing and Reliability 3rd Annual Conference gets high marks: excellent speakers focused on an emerging topic and it was large enough to have “critical mass” while allowing everyone to interact. It was well produced by MEMS Investor Journal and MEPTEC.

My presentation, “Semiconductor Wafer Test Technology and Trends: Lessons for MEMS Test Engineers“, covered the differences between testing semiconductors and microelectromechanical systems (MEMS). I reviewed the progress in test technology over the last fifty plus years, from simple cantilever probe cards to large full wafer contact probe cards, developed to reduce the cost of test.

I discussed lower cost solutions that appear counter-intuitive since they require increased technical and operational complexity. Challenges of testing MEMS devices while still on wafer (prior to packaging and singulation) were discussed along with a review of MEMS solutions at this year’s IEEE Semiconductor Wafer Test Workshop.

With the proper skills, experience, and perspective it is possible to avoid “re-inventing the wheel” and to develop the best strategy to profitably introduce new technologies to high volume manufacturing.

IEEE Semiconductor Wafer Test Workshop – Productivity / COO – Session Nine (Wednesday)

 

Semiconductor Wafer Test Workshop SWTW bannerHere are the highlights from Session Nine – “Productivity / COO” of the 21st annual IEEE Semiconductor Wafer Test Workshop (SWTW) from Wednesday June 15, 2011.

Doron Avidar, Micron, “Ghosting – Touchdown Reduction Using Alternate Site Sharing“:

Even though memory testers can support very high parallelism, with smaller memories (in terms of capacity and dimensions) there are more die per wafer requiring Continue reading “IEEE Semiconductor Wafer Test Workshop – Productivity / COO – Session Nine (Wednesday)”

Probe Card Cost Drivers from Architecture to Zero Defects

Click image to download presentation

As the final presenter at this week’s IEEE Semiconductor Wafer Test Workshop (SWTW), I outlined how critical it is to understand the true cost of a product’s architecture in “Probe Card Cost Drivers from Architecture to Zero Defects“. Without a proper understanding of these costs – especially for fully custom high technology products such as wafer test probe cards – it is impossible to maintain a sufficient gross margin. Gross margin is essential to maintain the health of a company and to fund the research & development required for innovation.

Many companies in the semiconductor test market have entered a period that Steve Newberry identified in his 2008 speech “Semiconductor Industry Trends: The Era of Profitless Prosperity?” that parallels the aluminum industry in the 1970’s. And without the means to fund innovation, companies have no future especially when faced with the double threat of Moore’s Law – increasingly harder technical requirements delivered at lower cost.

Yes, there were a few in the audience who appeared pleased since they are confident that their products are on the right path. There were others who may have been upset based upon their company’s direction. I would argue that a proper diagnosis – regardless of how disturbing – is essential to drive the proper cure.

There is plenty of opportunity in the test market and reasons for optimism. The key to long term prosperity is to really understand the fundamentals of the business and not be blinded by the technology.

I thank those who stayed for the entire conference and welcome your thoughts below. And I will be posting more about the conference (including my summaries) in the next few weeks.

 

iPad Memories

…or Memory Magic via More Than Moore

Toshiba 16 Die Stack (64 GB NAND Flash)

No this isn’t a soliloquy to an Apple iPad that is no longer, but a brief tour of the incredible memory, packaging, and system technology that can be found under the hoods of the original iPad and the iPad 2 along with some of the manufacturing and test implications. These devices clearly demonstrate the new paradigm of “More Than Moore“ where scaling of systems and packaging will propel the next wave of growth in electronics beyond the traditional doubling of performance every two years predicted by Moore’s Law. For many in semiconductor packaging and test engineering communities the issues related to More than Moore have been an academic discussion up to now, but clearly the success of the iPad product line shows the current reality for advanced devices and where the future is headed. Apple and their suppliers took huge risks in developing these new technologies in exchange for substantial returns.

As I recently noted in “Memory Alphabet Soup“, the most pressing question about memory most consumers currently have is “which iPad 2?” – 16 GB, 32 GB, or 64 GB? If Mr. Jobs believed in Continue reading “iPad Memories”

Preparing to Succeed

Two fatal management extremes:
“Analysis Paralysis” and “Just Do It”

“Analysis Paralysis” – over-analyzing the situation resulting in no action – prevents progress when overly detailed plans are made. It can be caused by corporate culture (no action = no criticism of possible failure), budget restraints (study costs are minimal; action costs are major), and/or no confidence in the outcome.

“Just Do It“, the other extreme, may be the response to a protracted case of analysis paralysis or “full speed ahead” management style. Regardless of the cause, proper preparation is often neglected especially when budget and/or time are constrained.

What is the proper balance between the two? How does one change default behavior?

Continue reading “Preparing to Succeed”

MEMS Technology Summit – Day One – AM (1) – Special Presentations

MEMS Products Phases of Development - Yole Research
Last Tuesday,the MEMS Technology Summit at Stanford University, opened with a welcome by Professor Roger Howe. Roger not only provided a brief history of MEMS at Stanford, he was his characteristic gracious self and welcomed even those with close ties to Berkeley especially the Berkeley Sensor and Actuator Center (BSAC). Truth-be-told even though Roger is a Mudder first, Continue reading “MEMS Technology Summit – Day One – AM (1) – Special Presentations”

The night my computers died…

Electrical Receptacle Wall Plug AC Outlet Ground Tester
Got one?

And how I became intimate with my water heater.

Suddenly, all the computers in my office fell silent but strangely the room lights were still on. After initial panic and bewilderment, I was able to solve the mystery and was again reminded of the value of standards and budgeting to do it right from the beginning (pay now to avoid paying more later).

Even though I did not immediately respond by formally establishing a structured problem solving methodology with an eight step discipline (or other QMS variant), my engineering background intuitively guided me through a similar process. This was also a reminder that troubleshooting very simple systems without advanced preparation can be fairly complex and time consuming, therefore proactive preparation for complex systems is essential.

Continue reading “The night my computers died…”

Beware the Cost of Complexity

Early in my career in Hewlett-Packard manufacturing, we did a study that showed that the greater the configuration options we put on a single product the higher the cost to produce every other product in the same factory. Known as “Cost of Complexity” this has been found in many different industries with examples from software coding, to network support to food production. Not to mention in our own products, companies, and everyday lives.

Continue reading “Beware the Cost of Complexity”

HOW and WHY things work!

The Art of the Teardown...

Miss Peach by Mell Lazarus (2/17/1974)

As a child I spent a lot of time taking things apart. My parents were relieved when a Miss Peach cartoon identified my behavior as explorative engineering rather than plain old fashioned destroying things. I was reminded of this again by the rash of recent blogs/articles by companies such as UBM Techinsights and Chipworks that estimate the cost of the iPhone 4 and similar devices-du-jour through teardowns. An excellent blog post last week by Steve Cheney recalled for me there’s a lot more to the story than simply documenting the bills of material (BOM) and estimating component costs.

Yes, it is interesting to know that the 16 GB iPhone 4 costs Apple approximately $188 in material and that you can buy one from AT&T (with a 2 year contract) for about the same price ($199). However, as a consumer, knowing this is simply “academic” since I can’t use this data to change the outcome: I either buy the phone or I don’t. Is there more to the story? Is there any real commercial value to a teardown?
Continue reading “HOW and WHY things work!”