Coupling & Crosstalk: Trust your Paranoia!

Coupling & Crosstalk is my column in the MEPTEC Report. This column appears in the Winter 2019 edition on pages 11-12.

Electronic coupling is the transfer of energy from one circuit or medium to another. Sometimes it is intentional and sometimes not (crosstalk). I hope that this column, by mixing technology and general observations, is thought provoking and “couples” with your thinking. Most of the time I will stick to technology but occasional crosstalk diversions may deliver a message closer to home.

Trust Your Paranoia!

President Ronald Reagan’s use of the Russian proverb “Doveryai, no proveryai was the perfect soundbite to describe the 1987 Intermediate-Range Nuclear Forces Treaty. What does this and Andy Grove’s “only the paranoid survive” have to do with semiconductors? Continue reading “Coupling & Crosstalk: Trust your Paranoia!”

Coupling & Crosstalk: KGD Redux?

Coupling & Crosstalk is my column in the MEPTEC Report. This column appears in the Fall 2019 edition on pages 9-10.

Electronic coupling is the transfer of energy from one circuit or medium to another. Sometimes it is intentional and sometimes not (crosstalk). I hope that this column, by mixing technology and general observations, is thought provoking and “couples” with your thinking. Most of the time I will stick to technology but occasional crosstalk diversions may deliver a message closer to home.

KGD Redux?

Known Good Die (KGD) – Is this a case of “everything old is new again” or acid reflux from a mature semiconductor industry?  Today there is a greater need than ever to know that a given semiconductor die is good before proceeding to package it.  This particular quest for the holy grail has provided plenty of Continue reading “Coupling & Crosstalk: KGD Redux?”

Coupling & Crosstalk: Moore Has Left the Building!

Dollars-Electronics canstockphoto8813445 Geleol 300x330Coupling & Crosstalk is my column in the MEPTEC Report. This column appears in the Summer 2016 edition on pages 12-13.

Electronic coupling is the transfer of energy from one circuit or medium to another. Sometimes it is intentional and sometimes not (crosstalk). I hope that this column, by mixing technology and general observations, is thought provoking and “couples” with your thinking. Most of the time I will stick to technology but occasional crosstalk diversions may deliver a message closer to home.

Moore has Left the Building!

Unlike Elvis, Gordon Moore, the co-founder of Intel, is still with us. Although the debate continues among very smart people as to whether Moore’s Law is “truly dead”, this argument is now purely academic. As the electronics industry has moved to the “Post Personal Computer (PC) Era”, Moore’s Law which accurately predicted price over time for complementary metal–oxide–semiconductor (CMOS) integrated circuits, is no longer relevant.

Heresy! Did he just say that Moore’s Law doesn’t matter? Continue reading “Coupling & Crosstalk: Moore Has Left the Building!”

Coupling & Crosstalk: Disposable Chips?

cups plates forks canstockphoto2604892 250x345Coupling & Crosstalk is my column in the MEPTEC Report. This column appears in the Spring 2014 edition on pages 10-11.

Electronic coupling is the transfer of energy from one circuit or medium to another. Sometimes it is intentional and sometimes not (crosstalk). I hope that this column by mixing technology and general observations is thought provoking and “couples” with your thinking. Most of the time I will stick to technology but occasional crosstalk diversions may deliver a message closer to home.

Disposable Chips?

I’m not a fan of disposable cups and other tableware. Yes, they are convenient and in some cases even economical. However, they are not great substitutes for Continue reading “Coupling & Crosstalk: Disposable Chips?”

SEMI ISS 2014 – Scaling Innovation

Courtesy of Ivo Bolsens (Xilinx), SEMI ISS 2014
Courtesy of Ivo Bolsens (Xilinx), SEMI ISS 2014

Don’t pop the champagne just yet! Although plenty of good news was shared at the 2014 SEMI Industry Strategy Symposium (ISS) there was the sobering outlook of possible limited long-term growth due to technology issues as well as economic projections. Noticeable was the lack of news and updates on key industry developments.

This is the yearly “data rich” or “data overload” (take your pick) conference of semiconductor supply chain executives. The majority of the attendees and presenters are from the SEMI member companies that develop the equipment, materials, processes, and technology used to build, test, and package semiconductors. Keeping the pressure on for advanced technology were the “end customer” attendees and presenters – semi-conductor manufacturers.

The official theme was “Pervasive Computing – An Enabler for Future Growth” and the presentations made it clear  Continue reading “SEMI ISS 2014 – Scaling Innovation”

Chip Scale Review: The Three Most Important Words for 3D ICs?

Source: Bryan Black (AMD)
Source: Bryan Black (AMD)

Below is my event summary recently published in Chip Scale Review Tech Monthly:

Cost! Cost! Cost! are the three most important words for 3D semiconductors.

Just like the real estate mantra “location, location, location”, if you don’t have a solution to the cost issues nothing else matters for 2.5/3D integrated circuit (IC) integration and packaging. It is true that, Xilinx is shipping “production” quantities of 2.5D parts and others have sampled 3D parts. However, there are plenty of technical challenges yet to be solved to make 2.5/3D practical in volume production at reasonable cost and yield.

Every presenter at the 3D Architectures for Semiconductor Integration and Packaging symposium and conference stressed cost as a major concern, requirement, or feature. Over the ten years the discussion at this conference, organized by RTI International Technology Venture Forum, has moved from Continue reading “Chip Scale Review: The Three Most Important Words for 3D ICs?”

Coupling & Crosstalk: Name Calling

good bad dice canstockphoto9654181 250x320Coupling & Crosstalk is my column in the MEPTEC Report. This column appears in the Summer 2013 edition on pages 13-14.

Electronic coupling is the transfer of energy from one circuit or medium to another. Sometimes it is intentional and sometimes not (crosstalk). I hope that this column by mixing technology and general observations is thought provoking and “couples” with your thinking. Most of the time I will stick to technology but occasional crosstalk diversions may deliver a message closer to home.

Name Calling

What’s in a name? A lot! A name itself might not mean much but it can trigger expectations and stereotypes. In the United States we have red states and blue states depending on which political party has the majority vote. Similarly, when someone labels themselves on the basis of their political party affiliation (Republican, Democrat, Libertarian, Independent, etc.) others Continue reading “Coupling & Crosstalk: Name Calling”

Riding Off Into the Sunset – BiTS 2013

Sunset over Phoenix, Arizona during BiTS Workshop
Sunset over Phoenix, Arizona during BiTS Workshop

As the Burn-in & Test Strategies (BiTS) Workshop 2013 fades into the sunset (queue the music), here is a round-up of the highlights. There were gun fights in the corral as well as technical questions for the presenters. The saloon girls and gunfighters took an edge off of the “geek” factor. This year over three hundred fifty people come to the “Circle BiTS Ranch” (aka the Hilton in Mesa, Arizona) for the premier conference focused on what is new and next for semiconductor test tooling and strategy. Oh, did I mention that the theme this year was Western?

This was the 14th annual BiTS Workshop, which has achieved the perfect conference trifecta of Continue reading “Riding Off Into the Sunset – BiTS 2013”

SEMI ISS: Sense of Scale

Intel shows first fully patterned 450 mm semiconductor wafer at SEMI ISS 2013
Intel shows first fully patterned 450 mm semiconductor wafer at SEMI ISS 2013

Attending the SEMI Industry Strategy Symposium (ISS) is like drinking from a fire hose with the additional risk of whiplash. Don’t get me wrong, it is an exquisite fire hose but sometimes the data presented can be overwhelming at this conference of semiconductor supply chain executives. The majority of the attendees and presenters are executives from the SEMI member companies that develop the equipment, materials, processes, and technology used to build, test, and package semiconductors. And the executives present from the semiconductor manufacturers are typically the “end customers”.

The greatest value of SEMI ISS, beyond the networking, is the strategic overview of the entire semiconductor ecosystem. What are the market drivers, the technology needed, and the roadmap status of this industry? It is true that we all know where we need to head courtesy of Moore’s Law and the International Technology Roadmap for Semiconductors which attempts to keep us on that trajectory. The pressure of consumers needing wanting greater functionality at lower costs is relentless. Much of the technological detail of this ecosystem is addressed in a myriad of other forums throughout the year. ISS ties these technical requirements, development needs, and business needs back to the strategic direction and desires of the global marketplace.

The whiplash comes from  Continue reading “SEMI ISS: Sense of Scale”

Chip Scale Review: News from 3-D Architectures for Semiconductor Integration and Packaging

Lego Blocks (flickr: antpaniagua)
Lego Blocks (flickr: antpaniagua)

My event summary recently published in Chip Scale Review Tech Monthly:

Is 3D semiconductor packaging really the Lego of the integrated circuit (IC) world? It is a great analogy for the range of possible solutions and flexibility provided by different flavors of 3D packaging (2.5D on interposer, 3D, 5.5D, etc.) and “colors” (homogenous and heterogeneous) of die stacks. Plenty of pictures of Legos and scanning electron microscope (SEM) images were shown last week at the RTI International Technology Venture Forum symposium and conference “3-D Architectures for Semiconductor Integration and Packaging”. Presenters clearly articulated the great promise of what could be built with 3D packaging. At the same time, progress towards solving the multitude of challenges to make this technology as pervasive, if not as easy to use and fun, as Legos was discussed.

The challenges span Continue reading “Chip Scale Review: News from 3-D Architectures for Semiconductor Integration and Packaging”

IEEE Semiconductor Wafer Test Workshop 2012 – Session 4 (Monday)

Click image to download presentation

Here are the highlights from Session Four “New Contactor Technologies and RF PCB Design” of the 22nd annual IEEE 
Semiconductor Wafer Test Workshop (SWTW) from Monday June 11, 2012.

A last minute change to balance the schedule moved my paperThe Road to 450 mm Semiconductor Wafers” from the previous session:

Many believe that Gordon Moore in his famous 1965 paper “The Experts Look Ahead: Cramming More Components onto Integrated Circuits” that has become know as Moore’s Law, said that the number of transistors on a device would double every year (later revised to every two years). He did not say quite that. What he said was  Continue reading “IEEE Semiconductor Wafer Test Workshop 2012 – Session 4 (Monday)”

Change the Rules to Win!

Some consider the many of billions of dollars invested in the semiconductor supply chain to be huge bets on yet to be proven technology and future business. Even if you take a strict view of this as simply business it is possible to learn something from gambling.

The Atlantic tells the fascinating story of how Don Johnson took Atlantic City casinos for $15 M playing blackjack. Last year he won $5 M from Borgata in February, $4 M from Caesars in March, and $6 M from Tropicana in April. This wasn’t luck and he wasn’t card counting. How did he do this and how does this connect to semiconductors and Apple?

Continue reading “Change the Rules to Win!”

Memory Technology – Off to the Races!

Speed and Power

If we were focused on just these two parameters, we could be talking about horses, cars, or airplanes. But throw in density, endurance, and price and it is a horse race of different color. Not only does the winning technology have to balance speed and power, it needs to pack more functionality per area at a lower cost than existing solutions. Along with the endurance to last ten or more years.

With annual revenues once exceeding $60 B and now running $45 B due to dropping demand and prices, the global market for semiconductor memory is an exciting race. It is hard to believe that NAND Flash has grown to Continue reading “Memory Technology – Off to the Races!”

Two Conferences – Two Industries Challenged By Post PC Era

Tim Cook introducing Apple's latest iPad

The “Post Personal Computer” (Post PC) era became the hot topic when Tim Cook introduced the latest iPad last week. Yes, calling it a “revolution” is definitely hype that is part of Apple‘s Post PC marketing campaign. Hype aside, it is clear that there has been a marked shift in digital hardware for the consumption of content and communication. The PC – be it a Windows, Mac, or Linux based system – is no longer “the device”. It is now one of many devices including portable music players (dominated by iPods), smart phones (lead by iPhones and Android based systems), and tablets (dominated by iPads). The shift is large and the impact is huge. To understand how big, watch the first three minutes of Mr. Cook’s presentation. Then you will understand why Apple had the largest market capitalization of any US company in February – the numbers are staggering.

Even though many were surprised to learn that we are now “Post PC”, some of us who have been developing strategies for the electronic supply chain have Continue reading “Two Conferences – Two Industries Challenged By Post PC Era”

SEMI ISS – Snapshot of a Wild Ride – Other Coverage

Michael Splinter (Applied Materials) - Relative industry cost improvements and volumes.

I hope that my summaries of the first day of SEMI Industry Strategy Symposium (ISS) 2012 in

provided useful insights to the economic roller coaster that is the semiconductor market and its equipment and material supply chain. There have also been several good reports Continue reading “SEMI ISS – Snapshot of a Wild Ride – Other Coverage”

SEMI ISS – Snapshot of a Wild Ride – Session 2

After a gloomy first session focused on world economics at SEMI Industry Strategy Symposium (ISS) 2012, Session 2 – Semiconductor Markets was significantly more upbeat.

Stephen G. Newberry (Vice Chairman of the Board,  Lam Research Corporation) started off with a way forward in Continue reading “SEMI ISS – Snapshot of a Wild Ride – Session 2”

SEMI ISS – Snapshot of a Wild Ride – Session 1

Like the roller coaster ride that is the semiconductor industry, the SEMI Industry Strategy Symposium (ISS) 2012 had its share of ups, downs, twists, and turns. Semiconductor Equipment and Materials International – better known as SEMI – as the industry association of suppliers to semiconductor manufacturers has held this annual conference in early January for thirty five years to provide updates on business conditions and technology roadmaps to enable SEMI members to plan for the coming year. The conference was packed with senior management paying close attention to the industry leaders, analysts, and customer presenters. All of the presentations, even the most poorly disguised sales pitch or infomercial, contained several valuable insights.

In his keynote presentation “Technology Law Still Delivers“, William Holt (Senior Vice President; General Manager, Technology & Manufacturing Group, Intel Corporation) opened the conference with much optimism based upon Continue reading “SEMI ISS – Snapshot of a Wild Ride – Session 1”

Big Numbers – The Semiconductor Supply Chain

…To make sense of the big picture, one needs to follow the money and then head to China.

Ed Pausa the primary author of PricewaterhouseCooper’s (PwC) recently published report “Continued Growth: China’s Impact on the Semiconductor Industry – 2011 Update” provided an overview at this month’s MEPTEC luncheon. His presentation was a helpful tour to start digesting this impressive report, now it its seventh annual update. The report runs 112 pages in length and is packed with figures, data and most importantly analysis. Building a cohesive picture from many disparate data sources is a major undertaking and PwC should be applauded for making available this excellent work.

After listening to this presentation and reading the report, I find two items that really stand out as primary market forces. Unraveling the convoluted web of the semiconductor supply chain to examine these items will lead to greater understanding of the industry. They are, Continue reading “Big Numbers – The Semiconductor Supply Chain”

Semiconductor Packaging: 2.5D, 3D, and Beyond!

MEPTEC's 2.5D, 3D and Beyond Packaging Conference

The MEPTEC2.5D, 3D and Beyond – Bringing 3D Integration to Packaging Mainstream” conference was a mixed-bag. Yes, it is always exciting to hear about new suppliers and progress. But it is disconcerting to realize that the price of progress is an ongoing burden on our industry’s supply chain.

Subramanian Iyer (IBM) and Theresa Sze (Oracle) started with Continue reading “Semiconductor Packaging: 2.5D, 3D, and Beyond!”

IEEE Semiconductor Wafer Test Workshop – Opening Session & Keynote (Sunday)

On Sunday evening June 12th, 2011 Jerry Broz, the general conference chair, opened the IEEE Semiconductor Wafer Test Workshop welcoming us to the 21st year with a combined total attendance of over 5,000. He also briefly highlighted the positives in recent market trend data from the Semiconductor Industry Association (SIA) and VLSIresearch.

Dr. William Chen, Senior Technical Advisor, ASE Group, provided the keynote presentation “Backend to the Front Line”:

Dr. Chen started with Continue reading “IEEE Semiconductor Wafer Test Workshop – Opening Session & Keynote (Sunday)”

Probe Card Cost Drivers from Architecture to Zero Defects

Click image to download presentation

As the final presenter at this week’s IEEE Semiconductor Wafer Test Workshop (SWTW), I outlined how critical it is to understand the true cost of a product’s architecture in “Probe Card Cost Drivers from Architecture to Zero Defects“. Without a proper understanding of these costs – especially for fully custom high technology products such as wafer test probe cards – it is impossible to maintain a sufficient gross margin. Gross margin is essential to maintain the health of a company and to fund the research & development required for innovation.

Many companies in the semiconductor test market have entered a period that Steve Newberry identified in his 2008 speech “Semiconductor Industry Trends: The Era of Profitless Prosperity?” that parallels the aluminum industry in the 1970’s. And without the means to fund innovation, companies have no future especially when faced with the double threat of Moore’s Law – increasingly harder technical requirements delivered at lower cost.

Yes, there were a few in the audience who appeared pleased since they are confident that their products are on the right path. There were others who may have been upset based upon their company’s direction. I would argue that a proper diagnosis – regardless of how disturbing – is essential to drive the proper cure.

There is plenty of opportunity in the test market and reasons for optimism. The key to long term prosperity is to really understand the fundamentals of the business and not be blinded by the technology.

I thank those who stayed for the entire conference and welcome your thoughts below. And I will be posting more about the conference (including my summaries) in the next few weeks.

 

Memory Alphabet Soup

iSuppli Flash Market Forecast (Jan 2011)

There are so many different types of memory technologies that there is an alphabet soup of acronyms. Ever wonder why we have many different memory technologies some long forgotten with more on the horizon? I refreshed my own memory after last week’s IEEE Nano Technology Council presentation on conductive bridge random access memory (CBRAM).

 

The simple answer is Continue reading “Memory Alphabet Soup”