Green on the Industrial Scale

May 21, 2012

Molecular Layer Deposition of Polymers – George, Yoon & Dameron [4]

Many exotic materials or materials with special properties are processed using extreme temperature and pressure often with toxic starting materials. In semiconductors, molecular beam epitaxy (MBE) to build single crystal structures and sputtering are common methods of physical deposition to deposit thin films. Both are done using a very high vacuum. MBE heats the atomic materials until they sublimate and land on the desired surface. Sputtering uses a gas plasma to knock a few atoms of material off a “target” and onto the desired surface. There are also different chemical deposition processes including electroplating which uses metal salts dissolved in a solution bath, chemical vapor deposition (CVD) which uses high vacuum, and atomic layer deposition (ALD) which is similar to CVD but uses two half-reactions of gas phase precursors

Limitations imposed by extreme temperature, extreme pressure, and toxic materials combined with a typically slow deposition rate make it is difficult to economically run these processes on an industrial scale for high volume manufacturing. But what if there was a process that  Read the rest of this entry »


IEEE Consumer Electronics Society – Conductive Inkjet Technology

May 26, 2010

Last night I attended the IEEE Santa Clara Valley Consumer Electronics Society monthly meeting. The main presentation was by Joel Yocom, Business Development Manager for Conductive Inkjet Technology Ltd.

His presentation will be posted here later.

Joel presented an overview of inkjet technology and how they are applying it to printing circuits. They have developed a process that allows them to inkjet a catalytic ink which after UV curing allows the electroless (e-less) plating of copper. Given the choice of inkjet systems from scanning formats where the print head moves to fixed heads where the material moves past the head they have a wide range of potential substrate sizes and formats to choose depending on the end application. Read the rest of this entry »