March 14, 2013
Sunset over Phoenix, Arizona during BiTS Workshop
As the Burn-in & Test Strategies (BiTS) Workshop 2013 fades into the sunset (queue the music), here is a round-up of the highlights. There were gun fights in the corral as well as technical questions for the presenters. The saloon girls and gunfighters took an edge off of the “geek” factor. This year over three hundred fifty people come to the “Circle BiTS Ranch” (aka the Hilton in Mesa, Arizona) for the premier conference focused on what is new and next for semiconductor test tooling and strategy. Oh, did I mention that the theme this year was Western?
This was the 14th annual BiTS Workshop, which has achieved the perfect conference trifecta of Read the rest of this entry »
December 19, 2012
Lego Blocks (flickr: antpaniagua)
My event summary recently published in Chip Scale Review Tech Monthly:
Is 3D semiconductor packaging really the Lego of the integrated circuit (IC) world? It is a great analogy for the range of possible solutions and flexibility provided by different flavors of 3D packaging (2.5D on interposer, 3D, 5.5D, etc.) and “colors” (homogenous and heterogeneous) of die stacks. Plenty of pictures of Legos and scanning electron microscope (SEM) images were shown last week at the RTI International Technology Venture Forum symposium and conference “3-D Architectures for Semiconductor Integration and Packaging”. Presenters clearly articulated the great promise of what could be built with 3D packaging. At the same time, progress towards solving the multitude of challenges to make this technology as pervasive, if not as easy to use and fun, as Legos was discussed.
The challenges span Read the rest of this entry »
April 17, 2012
Speed and Power
If we were focused on just these two parameters, we could be talking about horses, cars, or airplanes. But throw in density, endurance, and price and it is a horse race of different color. Not only does the winning technology have to balance speed and power, it needs to pack more functionality per area at a lower cost than existing solutions. Along with the endurance to last ten or more years.
With annual revenues once exceeding $60 B and now running $45 B due to dropping demand and prices, the global market for semiconductor memory is an exciting race. It is hard to believe that NAND Flash has grown to Read the rest of this entry »
October 17, 2011
Here are the highlights from Session Nine – “Productivity / COO” of the 21st annual IEEE Semiconductor Wafer Test Workshop (SWTW) from Wednesday June 15, 2011.
Doron Avidar, Micron, “Ghosting – Touchdown Reduction Using Alternate Site Sharing“:
Even though memory testers can support very high parallelism, with smaller memories (in terms of capacity and dimensions) there are more die per wafer requiring Read the rest of this entry »
October 14, 2011
Here are the highlights from Session Seven – “High Temp / Extreme Probing” of the 21st annual IEEE Semiconductor Wafer Test Workshop (SWTW) from Tuesday June 14, 2011.
Kevin Fredriksen, SPA GmbH, ”MSO – Multi-Site Optimizer”:
Most wafer probers do not supply intelligent stepping algorithms to calculate the most efficient sequence of moving the wafer relative to the probe card. (Ed: At the core of this is a traveling salesman problem.) The situation is exacerbated when Read the rest of this entry »
July 26, 2011
Here are the highlights from Session Four – “High Performance Probing” of the 21st annual IEEE Semiconductor Wafer Test Workshop (SWTW) from Monday June 13, 2011.
Bob Davis, Rudolph Technologies, “Testing Probe Cards That Contain Complex Circuitry“:
Over time, probe cards have increased in complexity from simple wire cantilever probes to those including passive components and digital control circuits. Some of these digital control circuits may even contain state based logic. At the same time the physical complexity of probe cards have increased in probe and channel counts, probe density, and total probe force. As a result, Read the rest of this entry »
July 12, 2011
Here are the highlights from Session Three – “Power Probing” of the 21st annual IEEE Semiconductor Wafer Test Workshop (SWTW) from Monday June 13, 2011.
Michael Huebner, FormFactor, “A Hot Topic: Current Carrying Capacity, Tip Melting and Arcing”:
Power consumption per dynamic random-access memory (DRAM) is increasing to as high as 400 mA or more under normal test conditions. At the same time the number of DRAMs being tested in parallel – and sharing the same power supply – is increasing. Therefore, the risk of current damage to probes is increasing.
Two distinct, but related concerns are Read the rest of this entry »