Feldman Engineering 2012 Wrap Up


As we bid adieu to 2012, I realize that I have been remiss in providing updates on all of the exciting activity since my last one in May. I will rectify this situation below and have added regular updates to my list of New Year’s resolutions.


In May, it was great to see the many responses to the Big Hairy Audacious Goal where Janusz Bryzek (Fairchild Semiconductor) challenged the microelectromechanical systems (MEMS) industry at the MEMS Technology Symposium that I described in “Thinking Big: $1 Trillion MEMS Market” (part 1 and part 2). 

In June, I reviewed the test challenges of the transition to 450 mm semiconductor wafers with my presentation “The Road to 450 mm Semiconductor Wafers” at the IEEE Semiconductor Wafer Test Workshop (SWTW). I have posted summaries of this entire excellent workshop: keynote and sessions 1, 2, 3, 4, 5, 6, 7, 8, and 9.

In one very hectic July week, I attended the summer working meeting of the International Technology Roadmap for Semiconductors (ITRS), the SEMICON West trade show, and the Test Vision 2020 conference. The focus of  Continue reading “Feldman Engineering 2012 Wrap Up”