Tag: Feldman Engineering

Feldman Engineering 2012 Wrap Up

2012

As we bid adieu to 2012, I realize that I have been remiss in providing updates on all of the exciting activity since my last one in May. I will rectify this situation below and have added regular updates to my list of New Year’s resolutions.

Challenges

In May, it was great to see the many responses to the Big Hairy Audacious Goal where Janusz Bryzek (Fairchild Semiconductor) challenged the microelectromechanical systems (MEMS) industry at the MEMS Technology Symposium that I described in “Thinking Big: $1 Trillion MEMS Market” (part 1 and part 2). 

In June, I reviewed the test challenges of the transition to 450 mm semiconductor wafers with my presentation “The Road to 450 mm Semiconductor Wafers” at the IEEE Semiconductor Wafer Test Workshop (SWTW). I have posted summaries of this entire excellent workshop: keynote and sessions 1, 2, 3, 4, 5, 6, 7, 8, and 9.

In one very hectic July week, I attended the summer working meeting of the International Technology Roadmap for Semiconductors (ITRS), the SEMICON West trade show, and the Test Vision 2020 conference. The focus of  Continue reading “Feldman Engineering 2012 Wrap Up”

IEEE Semiconductor Wafer Test Workshop 2012 – Session 4 (Monday)

Click image to download presentation

Here are the highlights from Session Four “New Contactor Technologies and RF PCB Design” of the 22nd annual IEEE 
Semiconductor Wafer Test Workshop (SWTW) from Monday June 11, 2012.

A last minute change to balance the schedule moved my paper “The Road to 450 mm Semiconductor Wafers” from the previous session:

Many believe that Gordon Moore in his famous 1965 paper “The Experts Look Ahead: Cramming More Components onto Integrated Circuits” that has become know as Moore’s Law, said that the number of transistors on a device would double every year (later revised to every two years). He did not say quite that. What he said was  Continue reading “IEEE Semiconductor Wafer Test Workshop 2012 – Session 4 (Monday)”