Semiconductor Wafer Test Workshop 2015 Presentation – Are You Really Going To Package That?

June 24, 2015
Are You Really Going To Package That? - Ira Feldman and Debbora Ahlgren - SW Test 2015

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I had the pleasure of presenting “Are You Really Going To Package That?” at the 25th annual Semiconductor Wafer Test Workshop (SW Test / SWTW) on Tuesday June 9, 2015. Debbora Ahlgren and I took this opportunity to step back and look at how old paradigms in test-cell integration may lead to suboptimal solutions.

In an effort to reduce the cost-of-test (COT), a number of customers are increasing the parallelism of logic wafer probe cards. However, due to the complexity such as pitch and number of probes, the pricing for these cards is reaching astronomical levels. We do not believe this trend is sustainable, let alone logical. The presentation suggested examples of alternative solutions. It is clear that critical solutions need to be optimized at the test cell, factory, and supply chain level not just at the consumable (probe card) level.

Trillion Sensors – TApps: Ultra-High Volume Sensor Applications for Global Challenges

December 29, 2014
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Click image to download San Diego TSensors Summit presentation (update of Munich)

It was my pleasure to organize and present at two TSensors Summits: Munich and San Diego this fall. The enthusiasm and intellectual “horsepower” of the presenters and attendees was incredible!

My presentations explain Read the rest of this entry »

IEEE Semiconductor Wafer Test Workshop 2014 Presentation

June 12, 2014
International Technology Roadmap for Semiconductors (ITRS) - Ira Feldman - IEEE SWTW2014

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At the 24th annual IEEE 
Semiconductor Wafer Test Workshop (SWTW) on Wednesday June 11, 2014,
I had the pleasure of presenting “International Technology Roadmap for Semiconductors”. This presentation was co-authored with Dave Armstrong (Advantest) and Marc Loranger (FormFactor).

For the last fifteen years the International Technology Roadmap for Semiconductors (ITRS) has been looking fifteen years into the future. Based upon technology requirements and other inputs, ranging from the gate size of transistors to advanced packaging technology, the Test and Test Equipment Technical Working Group (Test TWG) has worked to develop the requirements for test technology and equipment.

The Test TWG is over seventy volunteers with deep technical expertise in test from around the world and from every sized company – Fortune 100 to individual consultants – and every type of company – semiconductor independent device manufacturer (IDM), fabless semiconductor, foundry, outsourced assembly and test (OSAT), automated test equipment (ATE) suppliers, prober, probe card, socket, handler, and more. Through Read the rest of this entry »

IEEE Semiconductor Wafer Test Workshop 2013

June 10, 2013
Ideal 3D Stacked Die Test - Ira Feldman - IEEE SWTW2013

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I had the pleasure of presenting “Ideal 3D Stacked Die Test” in Session Two “Industry Trends and Advanced Packaging Challenges” of the 23rd annual IEEE 
Semiconductor Wafer Test Workshop (SWTW) on Monday June 10, 2013.

Integrated circuits using 2.5D advanced packaging are shipping. 3D packaging with thru-silicon vias (TSV) has been demonstrated. “5.5D” packages may not be far behind. Probe card suppliers have made progress building interconnect technology for the micro-bump arrays. Standards committees have started defining IC interface standards and test access protocols.

But what does the Test Engineer and Management really want? What can they afford? What are the most likely scenarios? Factors that determine which test technology can support the desired test flow are examined. In particular, probe card technology for probing TSV bumps and potential usage models are reviewed.

Riding Off Into the Sunset – BiTS 2013

March 14, 2013
Sunset over Phoenix, Arizona during BiTS Workshop

Sunset over Phoenix, Arizona during BiTS Workshop

As the Burn-in & Test Strategies (BiTS) Workshop 2013 fades into the sunset (queue the music), here is a round-up of the highlights. There were gun fights in the corral as well as technical questions for the presenters. The saloon girls and gunfighters took an edge off of the “geek” factor. This year over three hundred fifty people come to the “Circle BiTS Ranch” (aka the Hilton in Mesa, Arizona) for the premier conference focused on what is new and next for semiconductor test tooling and strategy. Oh, did I mention that the theme this year was Western?

This was the 14th annual BiTS Workshop, which has achieved the perfect conference trifecta of Read the rest of this entry »

LinkedIn Lady Radio Show: Marketing & Social Media Applications

October 18, 2012

Not enough time to plan, execute, and measure the ROI of the marketing for your business? Hey, there’s an app for that!

I was pleased to be Ken Herron’s guest on the October 24 edition of the LinkedIn Lady radio show. We had a great discussion about marketing and social media applications.

To hear the show:
   via iTunes
   download a MP3 file


Please send me your questions in the comments below or feel free to contact me directly if I can help your business!

Here is the show announcement:

As an independent consultant, Ira works with his high technology clients to move their products from concepts to commercialization. Marketing is an area of expertise in which he assists his clients, who range from solopreneurs to large publicly traded companies. At the same time, he markets his consulting services to his own customers. In this show, Ken and Ira will discuss marketing for small businesses. They will talk about marketing strategy, channel selection, and content optimization, which are even more important for business owners with limited time and resources. Ira and Ken will discuss all of the major social channels, including: Facebook, Twitter, LinkedIn, Pinterest, Instagram, YouTube, and Slideshare, and the latest free tools to help YOU get the most out of your social marketing efforts to grow your business.

Join Ira and Ken on your computer or smartphone on the Wednesday, October 24 LinkedIn Lady radio show at 4:00 p.m. Eastern / 1:00 p.m. Pacific. Only on the LinkedIn Lady radio show on the Rock Star Radio Network!

IEEE Semiconductor Wafer Test Workshop 2012 – Session 4 (Monday)

June 28, 2012

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Here are the highlights from Session Four “New Contactor Technologies and RF PCB Design” of the 22nd annual IEEE 
Semiconductor Wafer Test Workshop (SWTW) from Monday June 11, 2012.

A last minute change to balance the schedule moved my paperThe Road to 450 mm Semiconductor Wafers” from the previous session:

Many believe that Gordon Moore in his famous 1965 paper “The Experts Look Ahead: Cramming More Components onto Integrated Circuits” that has become know as Moore’s Law, said that the number of transistors on a device would double every year (later revised to every two years). He did not say quite that. What he said was  Read the rest of this entry »