Here are the highlights from Session Eight “Probe Process and Metrology” of the 22nd annual IEEE Semiconductor Wafer Test Workshop (SWTW) from Wednesday June 13, 2012.
Rob Marcelis (BE Precision Technology ‐ The Netherlands), “H3D Profiler for Contact Less Probe‐Card Inspection”:
Probe cards require inspection since they are consumables subject to wear. Changes in probe position or shape can damage the semiconductor devices they are testing. As probe cards increase in size and probe count, the probe cards themselves are becoming more expensive to test in terms of test time and complexity. Each new test system typically requires an expensive “motherboard” for the probe card metrology tool to simulate the mechanics of the tester and provide electrical interconnect to the card for electrical testing.
BE Precision Technology took a different approach by Continue reading “IEEE Semiconductor Wafer Test Workshop 2012 – Session 8 (Wednesday)”