Silicon Valley Test Workshop – 2nd Year “Rocks”

2 5D? 3D? What? 3D IC Packaging - Ira Feldman
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Back for the second year (with a minor name change), the Silicon Valley Test Workshop is an unpolished gem. Looking past the rough edges (minor logistical issues), what really shines through is the interaction of the participants. This conference really has Continue reading “Silicon Valley Test Workshop – 2nd Year “Rocks””

Semiconductor Packaging: 2.5D, 3D, and Beyond!

MEPTEC's 2.5D, 3D and Beyond Packaging Conference

The MEPTEC2.5D, 3D and Beyond – Bringing 3D Integration to Packaging Mainstream” conference was a mixed-bag. Yes, it is always exciting to hear about new suppliers and progress. But it is disconcerting to realize that the price of progress is an ongoing burden on our industry’s supply chain.

Subramanian Iyer (IBM) and Theresa Sze (Oracle) started with Continue reading “Semiconductor Packaging: 2.5D, 3D, and Beyond!”