Is 3D semiconductor packaging really the Lego of the integrated circuit (IC) world? It is a great analogy for the range of possible solutions and flexibility provided by different flavors of 3D packaging (2.5D on interposer, 3D, 5.5D, etc.) and “colors” (homogenous and heterogeneous) of die stacks. Plenty of pictures of Legos and scanning electron microscope (SEM) images were shown last week at the RTI InternationalTechnology Venture Forum symposium and conference “3-D Architectures for Semiconductor Integration and Packaging”. Presenters clearly articulated the great promise of what could be built with 3D packaging. At the same time, progress towards solving the multitude of challenges to make this technology as pervasive, if not as easy to use and fun, as Legos was discussed.
This year’s IEEESemiconductor Wafer Test Workshop started on Sunday June 10th with a pleasant surprise. Due to a welcomed but unexpected wave of seventy walk-in registrations, there was insufficient seating at the opening dinner. Thankfully the hotel staff quickly adjusted to accommodate these additional guests. Attendance and interest in this year’s workshop was clearly up.
Jerry Broz, general conference chair, welcomed everyone with a brief overview and presented prizes for the first annual golf tournament. We then quickly proceeded with business as Matt Nowak (Senior Director, Advanced Technology, Qualcomm CDMA Technologies) provided the keynote “Emerging High Density 3D Through Silicon Stacking (TSS) – What’s Next?” Mr. Nowak discussed the increased amount of hype within the 3D semiconductor packaging market in the last year with everyone announcing something. And Thru Silicon Vias (TSVs) technology has already been in high volume production for image sensors for several years now but at a significantly lower density than for 3D packaging.
The “Post Personal Computer” (Post PC) era became the hot topic when Tim Cook introduced the latest iPad last week. Yes, calling it a “revolution” is definitely hype that is part of Apple‘s Post PC marketing campaign. Hype aside, it is clear that there has been a marked shift in digital hardware for the consumption of content and communication. The PC – be it a Windows, Mac, or Linux based system – is no longer “the device”. It is now one of many devices including portable music players (dominated by iPods), smart phones (lead by iPhones and Android based systems), and tablets (dominated by iPads). The shift is large and the impact is huge. To understand how big, watch the first three minutes of Mr. Cook’s presentation. Then you will understand why Apple had the largest market capitalization of any US company in February – the numbers are staggering.
Traditional burn-in systems hold multiple printed circuit boards (PCBs) with one or more devices in burn-in sockets to provide temporary electrical interconnect to a device under test (DUT). These PCBs and sockets are known as “burn-in boards”. And the systems in which they are loaded are “ovens” that permit temperature stressing, sometimes at both hot and cold temperatures, while stimuli are supplied to the chip. The purpose of “burning-in” a device is to screen for infant mortality in an accelerated manner.