Thinking Big: $1 Trillion MEMS Market – Part 2

Part 1 described Janusz Bryzek‘s ambitious goal of a $1 trillion market for microelectromechanical systems (MEMS) that was the focus of the MicroElectronics Packaging and Test Council (MEPTEC) 10th annual MEMS Technology Symposium. In addition, sensor swarms, road mapping and market numbers were covered. Challenges, example applications, and key takeaways are discussed here along with a final score card on the $1 T market.

Continue reading “Thinking Big: $1 Trillion MEMS Market – Part 2”

Thinking Big: $1 Trillion MEMS Market – Part 1

Usual business advice includes thinking big to win big. Some organizations create Big Hairy Audacious Goals. Others like to find new markets that are underserved and grow to be number one. The semiconductor industry has Moore’s Law – the premise that the minimum cost point is achieved by doubling the number of transistors per chip every two years – driving it forward for almost fifty years.

Janusz Bryzek set a dramatic and ambitious goal of $1 trillion sales for the microelectromechanical systems (MEMS) market in 2022. Even though the MEMS market is expected to have “only” $12 billion in revenue in 2012, he isn’t being called a fool. Having cofounded eight seminal Silicon Valley MEMS companies and currently the Vice President of MEMS Development at Fairchild Semiconductor (which recently acquired his last company), Janusz is taken quite seriously.

Yes, at last week’s MicroElectronics Packaging and Test Council (MEPTEC) 10th annual MEMS Technology Symposium there were some who  Continue reading “Thinking Big: $1 Trillion MEMS Market – Part 1”

Big Numbers – The Semiconductor Supply Chain

…To make sense of the big picture, one needs to follow the money and then head to China.

Ed Pausa the primary author of PricewaterhouseCooper’s (PwC) recently published report “Continued Growth: China’s Impact on the Semiconductor Industry – 2011 Update” provided an overview at this month’s MEPTEC luncheon. His presentation was a helpful tour to start digesting this impressive report, now it its seventh annual update. The report runs 112 pages in length and is packed with figures, data and most importantly analysis. Building a cohesive picture from many disparate data sources is a major undertaking and PwC should be applauded for making available this excellent work.

After listening to this presentation and reading the report, I find two items that really stand out as primary market forces. Unraveling the convoluted web of the semiconductor supply chain to examine these items will lead to greater understanding of the industry. They are, Continue reading “Big Numbers – The Semiconductor Supply Chain”

Semiconductor Packaging: 2.5D, 3D, and Beyond!

MEPTEC's 2.5D, 3D and Beyond Packaging Conference

The MEPTEC2.5D, 3D and Beyond – Bringing 3D Integration to Packaging Mainstream” conference was a mixed-bag. Yes, it is always exciting to hear about new suppliers and progress. But it is disconcerting to realize that the price of progress is an ongoing burden on our industry’s supply chain.

Subramanian Iyer (IBM) and Theresa Sze (Oracle) started with Continue reading “Semiconductor Packaging: 2.5D, 3D, and Beyond!”

Semiconductor Wafer Test Technology and Trends: Lessons for MEMS Test Engineers

Lessons for MEMS Test Engineers
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The MEMS Testing and Reliability 3rd Annual Conference gets high marks: excellent speakers focused on an emerging topic and it was large enough to have “critical mass” while allowing everyone to interact. It was well produced by MEMS Investor Journal and MEPTEC.

My presentation, “Semiconductor Wafer Test Technology and Trends: Lessons for MEMS Test Engineers“, covered the differences between testing semiconductors and microelectromechanical systems (MEMS). I reviewed the progress in test technology over the last fifty plus years, from simple cantilever probe cards to large full wafer contact probe cards, developed to reduce the cost of test.

I discussed lower cost solutions that appear counter-intuitive since they require increased technical and operational complexity. Challenges of testing MEMS devices while still on wafer (prior to packaging and singulation) were discussed along with a review of MEMS solutions at this year’s IEEE Semiconductor Wafer Test Workshop.

With the proper skills, experience, and perspective it is possible to avoid “re-inventing the wheel” and to develop the best strategy to profitably introduce new technologies to high volume manufacturing.