MEMS Testing and Reliability 2012 – Session 3

November 13, 2012

Can reliability and production testing keep pace with the explosive growth in  microelectromechanical system (MEMS) based product volumes? Soon it will be the rare consumer product that does not include a MEMS device bringing us closer to the possibility of a $1 trillion MEMS market. In order to achieve greater adoption of the technology, cost and quality goals will need to be met through testing and reliability. This was the focus of the MEMS Testing and Reliability 2012 conference produced by MEMS Journal and MicroElectronics Packaging and Test Council (MEPTEC).

 

Session 3

Pavan Gupta (Vice President of Operations, SiTime) provided a cautionary tale in “Packaging and Reliability Qualification of MEMS Resonator Devices”. Historically many MEMS companies have failed to start the device and package co-design as early as possible even though packaging was upwards of 80% of the product cost. [Perhaps they aren't really using a concurrent engineering methodology?] Even though the cost of packaging has dropped significantly, the complexities and risks related to packaging remain high.

There are many challenges related to MEMS packaging since without a reliable and qualified package, it is not possible for one’s customers to easily and confidently integrate a MEMS product into their end product. In SiTime’s case they had a double challenge of Read the rest of this entry »

Leave a Comment » | High Volume Manufacturing (HVM), MEMS, MEMS Journal, MEMS Test, MEPTEC, Microfabrication, Nanotechnology, Semiconductor Test | Tagged: , , , , , , , | Permalink
Posted by Ira Feldman

MEMS Testing and Reliability 2012 – Session 2

November 6, 2012

Can reliability and production testing keep pace with the explosive growth in  microelectromechanical system (MEMS) based product volumes? Soon it will be the rare consumer product that does not include a MEMS device bringing us closer to the possibility of a $1 trillion MEMS market. In order to achieve greater adoption of the technology, cost and quality goals will need to be met through testing and reliability. This was the focus of the MEMS Testing and Reliability 2012 conference produced by MEMS Journal and MicroElectronics Packaging and Test Council (MEPTEC).

Session 2

Mårten Vrånes (Director of Consulting Services, MEMS Journal) in “A Test-centric Approach to MEMS ASIC Development” discussed alternatives to the traditional co-design of the MEMS element and application specific integrated circuit (ASIC). As many MEMS devices require an ASIC to control and/or sense the MEMS element the most logical approach is to design both parts in parallel. However the scope of such a development effort is often beyond the resources – both in terms of talent and funding – for many companies especially startups.

Mr. Vrånes started with the challenges and pitfalls of ASIC development for MEMS devices. There are challenges regardless of Read the rest of this entry »

Leave a Comment » | Design Cycles, High Volume Manufacturing (HVM), MEMS, MEMS Journal, MEMS Test, MEPTEC, Microfabrication, Nanotechnology, Semiconductor Test | Tagged: , , , , , , , , | Permalink
Posted by Ira Feldman

MEMS Testing and Reliability 2012 – Session 1

October 31, 2012

It was my pleasure to attend the MEMS Testing and Reliability 2012 conference to see the considerable progress made in these areas as microelectromechanical system (MEMS) based product volumes accelerate. We may soon get to the point where it will be the rare consumer product that does not include a MEMS device bringing us closer to the possibility of a $1 trillion MEMS market. But in order to achieve greater adoption of the technology, cost and quality goals will need to be met through testing and reliability, the focus of this conference produced by MEMS Journal and MicroElectronics Packaging and Test Council (MEPTEC).

Session 1

Mario Correa (MEMS Test Engineering Manager of Fairchild Semiconductor) started with “Evolution of MEMS Test Solutions” reviewing how test equipment and processes have evolved from the 1960′s to today. There have been major changes to test methods developed for non-MEMS sensors first used with military and aerospace MEMS sensors in the late 1960′s where the annual volume was measured in thousands of units to those used today for over three billion units shipped yearly to the consumer electronics market. It has been a challenge keeping up with the high triple digit growth rates from 2009 to 2012 including gyroscopes +189%, microphones +347%, and digital compasses +778%. MEMS accelerometers grew “only” +78% during this period. (Growth data per Yole)

These changes include Read the rest of this entry »

3 Comments | High Volume Manufacturing (HVM), MEMS, MEMS Journal, MEMS Test, MEPTEC, Microfabrication, Semiconductor Test | Tagged: , , , , , , | Permalink
Posted by Ira Feldman

LinkedIn Lady Radio Show: Marketing & Social Media Applications

October 18, 2012


Not enough time to plan, execute, and measure the ROI of the marketing for your business? Hey, there’s an app for that!

I was pleased to be Ken Herron’s guest on the October 24 edition of the LinkedIn Lady radio show. We had a great discussion about marketing and social media applications.

To hear the show:
   via iTunes
   download a MP3 file

 

Please send me your questions in the comments below or feel free to contact me directly if I can help your business!

Here is the show announcement:

As an independent consultant, Ira works with his high technology clients to move their products from concepts to commercialization. Marketing is an area of expertise in which he assists his clients, who range from solopreneurs to large publicly traded companies. At the same time, he markets his consulting services to his own customers. In this show, Ken and Ira will discuss marketing for small businesses. They will talk about marketing strategy, channel selection, and content optimization, which are even more important for business owners with limited time and resources. Ira and Ken will discuss all of the major social channels, including: Facebook, Twitter, LinkedIn, Pinterest, Instagram, YouTube, and Slideshare, and the latest free tools to help YOU get the most out of your social marketing efforts to grow your business.

Join Ira and Ken on your computer or smartphone on the Wednesday, October 24 LinkedIn Lady radio show at 4:00 p.m. Eastern / 1:00 p.m. Pacific. Only on the LinkedIn Lady radio show on the Rock Star Radio Network!

1 Comment | Marketing, My Presentations | Permalink
Posted by Ira Feldman

Coupling & Crosstalk: Painting Lessons

September 18, 2012

Joseph and Della Ready to Paint

Coupling & Crosstalk is my new column in the MEPTEC Report. This column appears in the Fall 2012 edition on page 10.

Electronic coupling is the transfer of energy from one circuit or medium to another. Sometimes it is intentional and sometimes not (crosstalk). I hope that this column by mixing technology and general observations is thought provoking and “couples” with your thinking. Most of the time I will stick to technology but occasional crosstalk diversions like this one may deliver a message closer to home!

Painting Lessons

It is time for our nine-year old twins to have their own bedrooms. The first step was to paint the rooms since the last time they were painted was well over ten years ago. Throughout the process I was reminded of many management and life lessons. Is this a worthwhile do-it-yourself (DIY) project? Does this first question set off the alarm bells? Can you Read the rest of this entry »

1 Comment | Coupling & Crosstalk, Home, Management, MEPTEC | Permalink
Posted by Ira Feldman

IEEE Semiconductor Wafer Test Workshop 2012 – Session 9 (Wednesday)

July 16, 2012

Semiconductor wafer test workshop swtw sign 500x352

Here are the highlights from Session Nine “Productivity / Cost of Ownership (COO)” of the 22nd annual IEEE Semiconductor Wafer Test Workshop (SWTW) from Wednesday June 13, 2012.

Teruyuki Kitagawa (Nomura Plating, Co., Ltd. – Japan), “Unique Characteristics of the Novel Carbonaceous Film with High Electrical Conductivity and Ultra High Hardness for Semiconductor Test Probes”:

In a follow-up to last year’s presentation, improvements to Nomura’s carbonaceous film were discussed. The film has a much higher hardness (Hv 4000) than palladium (Pd, Hv 350 ~ 400) or even diamond-like carbon (DLC, Hv 1000 ~ 2000) which provides wear resistance and acts as a self cleaning surface. The significant improvement since last year is  Read the rest of this entry »

Leave a Comment » | IEEE, Semiconductor Test, Semiconductor Wafer Test Workshop, Simulation, Spring Pins | Tagged: , , , , | Permalink
Posted by Ira Feldman

IEEE Semiconductor Wafer Test Workshop 2012 – Session 8 (Wednesday)

July 9, 2012

Semiconductor wafer test workshop swtw sign 500x352

Here are the highlights from Session Eight “Probe Process and Metrology” of the 22nd annual IEEE Semiconductor Wafer Test Workshop (SWTW) from Wednesday June 13, 2012.

Rob Marcelis (BE Precision Technology ‐ The Netherlands), “H3D Profiler for Contact Less Probe‐Card Inspection”:

Probe cards require inspection since they are consumables subject to wear. Changes in probe position or shape can damage the semiconductor devices they are testing. As probe cards increase in size and probe count, the probe cards themselves are becoming more expensive to test in terms of test time and complexity. Each new test system typically requires an expensive “motherboard” for the probe card metrology tool to simulate the mechanics of the tester and provide electrical interconnect to the card for electrical testing.

BE Precision Technology took a different approach by Read the rest of this entry »

Leave a Comment » | 2.5D/3D Stacked Integrated Circuits (ICs), IEEE, Probe Card Metrology Tools, Probe Cards, Semiconductor Capital Equipment (CAPEX), Semiconductor Test, Semiconductor Wafer Test Workshop | Tagged: , , , , , , | Permalink
Posted by Ira Feldman

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